Advanced Packaging Development Engineer

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Job Description:

Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.

Key job scope includes

- packaging technology roadmap future product needs for 3-5 years

- support development of key components (HBM, iVR, Si Cap) for advanced packaging

- manage reliability test to qualify new technology

- lead yield improvement activities for new technology ramp-up

The job requires intensive experience in related area - such as 2.5D/3D and HBM techno...