Associate Engineer (Backgrind &Dicing)

The Associate Engineer – Backgrind & Dicing position supports critical wafer manufacturing processes by processing backgrind and dicing before final shipment. This role focuses on operating, monitoring, and improving backgrinding and dicing processes, including equipment setup, process control, and defect reduction. The Associate Engineer works closely with process/eqpt engineers, product/lot owner and cross‑functional teams to troubleshoot issues, implement process improvements, and maintain compliance with safety and quality standards. This position is ideal for individuals with past hands‑on experiences in assembly/backgrind/dicing.

• Support daily run of backgrind and dicing
• Perform incoming and outgoing inspections
• Perform laminating, taping/detaping, backgrind and dicing as per process requirements
• Perform thickness measurement and enter data into SiView
• Carry out equipment PM according to...