Job Description

Job Summary: 

  • This job requires a full-time Staff engineer with strong engineering knowledge and skills in wire bond equipment and process for early engagement in technical problem-solving, cross-site collaboration to support NPD qualification and high-volume manufacturing (HVM)
  • Lead the development, optimization, and qualification of wirebond processes for new and existing semiconductor packages, ensuring robust manufacturability, reliability compliance, and alignment with technology roadmaps.
  • Good knowledge in Six Sigma methodology and the DMAIC approach.
  • Practice good quality system and production control.
  • Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition. 

    • Requirements:

  • Minimum Bachelor's / Master Degree in Electronic, Electrical, Microelectronic, Mechatronic Engineering or equivalent.
  • Minimum of 8 years work experience as...

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