IC Package Design Engineer

Walk-In Drive: IC Package Design Engineer (3+ Years)

🚀 Weekend Hiring Drive – HCLTech | Bangalore (Jigani Campus)

HCLTech is hiring skilled professionals for the role of IC Package Design Engineer. If you have a passion for advanced package and PCB design, we invite you to attend our walk-in drive!

📅 Interview Details

• Date: 16 May 2026 (Saturday)
• Time: 9:00 AM – 2:00 PM
• Venue: Tower 4, GF café 3 , HCLTech, Jigani Campus, Bangalore
• Mode: Face-to-Face (F2F)
• SPOC: Mareeswari C M

💼 Role: IC Package Design Engineer

Experience: 3+ Years

🔧 Key Responsibilities & Required Skills

• Strong experience in IC Package / Substrate Design (mandatory)
• Hands-on experience with Cadence APD (Allegro Package Designer)
• Good understanding of package/substrate design and assembly rules, especial...