Job Description
**Job Details:**
**Job Description:**
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:
• Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation equipment, materials, and fabrication processes t...
**Job Description:**
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:
• Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation equipment, materials, and fabrication processes t...
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