Job Description

Qualifications

  • Bachelor’s degree in chemistry / chemical engineering / Material Science / Applied Chemistry
  • Minimum 5 years of working experience in electroless plating / electroplating / surface finishing industry.
  • Hands‑on experience in production plating line environment (Ni‑P, Ni‑Au, Cu, etc.)
  • Experience in handling process troubleshooting, chemical bath control, and yield improvement
  • Exposure to semiconductor/PCB/precision component plating is preferred
  • Strong knowledge in electroless plating chemistry (Ni, Cu, Au systems)
  • Understand chemical reaction control, bath stability, and contamination control
  • Ability to perform process optimization and parameter adjustment
  • Experience in analytical tools (e.g. titration, pH control, XRF, thickness measurement)
  • Knowledge in failure analysis (blister, discoloration, adhesion issue, corrosion)
  • Familiar with SPC, DOE, CAPA,...

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