Job Description
Qualifications
- Bachelor’s degree in chemistry / chemical engineering / Material Science / Applied Chemistry
- Minimum 5 years of working experience in electroless plating / electroplating / surface finishing industry.
- Hands‑on experience in production plating line environment (Ni‑P, Ni‑Au, Cu, etc.)
- Experience in handling process troubleshooting, chemical bath control, and yield improvement
- Exposure to semiconductor/PCB/precision component plating is preferred
- Strong knowledge in electroless plating chemistry (Ni, Cu, Au systems)
- Understand chemical reaction control, bath stability, and contamination control
- Ability to perform process optimization and parameter adjustment
- Experience in analytical tools (e.g. titration, pH control, XRF, thickness measurement)
- Knowledge in failure analysis (blister, discoloration, adhesion issue, corrosion)
- Familiar with SPC, DOE, CAPA,...
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