Production Operator (Probe and Die Sales)

To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.

Responsibilities

• Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
• Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack

Qualifications

• Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college