Senior Engineer, Advanced Packaging Integration Engineering

Micron’s Advanced Packaging Technology Development (APTD) is responsible for delivering package development for high-performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Integration Engineer to join our APTD team.

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
• Improve product quality, drive yield improvements, reduce costs and enhance productivity.
• Integrate semiconductors while partnering with process and product engineering teams.
• Achieve and improve yields through silicon package integration innovation, including layout/design or process margin improvements.
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
• E...