Job Description

Job's mission

Build the foundation of nextgeneration semiconductor technologies.

What You Will Be Working On
  • Support the development and optimization of semiconductor processes for advanced packaging applications, including thinfilm deposition (ALD, PECVD, PVD, ECP) and surface preparation
  • Assist with planning and executing experiments, applying structured problem solving and basic DOE concepts
  • Collect, analyze, and document experimental data to support process learning and improvement
  • Develop new films or processes for emerging packaging applications like hybrid bonding and perform advanced materials characterization.
  • Perform hands‑on work with process equipment under guidance, including basic troubleshooting and tool characterization
  • Collaborate with cross‑functional teams such as equipment engineering, applications, and R&D to support process integration
  • Contribute to technical documentation...

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