Job Description

Job Responsibilities

  • Responsible for sustaining & improving the Wire Bond Process
  • Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for new products and regular production
  • Monitor and maintain assembly yield within KPI target
  • Key involvement in improving the systems to bring down scrap rate due to process excursions
  • Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly
  • Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target
  • Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically
  • Develop manufacturing work instructions and production routes along with engineering change o...

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