Job Description

  • Graduate of any BS Engineering Course
  • With at least 2 years experience in SMT Assembly as follows:
  • SMT Process FPC Baking (120ºC x 1Hr)
  • FPC Setup (A)
  • Solder Paste Apply (A)
  • SPI (A)
  • SMT Mounting Process
  • Pre-AOI
  • Reflow (A)
  • Post AOI
  • Mounting Area: Check-up/Touch-up
  • Electrical Check
  • Microscope Inspection(FVI 1-2)
  • Punch out (2)
  • Microscope Inspection(FVI 3-4)
  • Appearance Inspection(FVI 4-1)
  • QC Inspection
  • Pre-Packing
  • Knows how to use Microsoft office applications
  • Knowledgeable with Problem solving tools 8D, FMEA, SPC, OCAP, 7 Quality Control Tools, Six Sigma, DOE
  • Can effectively communicate.
  • Keen to details, can work and deliver result even under pressure, with good analytical and critical thinking.
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