Job Description
Responsibilities
- Responsible for system integration, setup, calibration and verification before handing over to application team.
- Work closely together with our production sites (in Malaysia and China) to provide support on technical topics and quality issues. Acts as technical lead and collaborate among multi-disciplinary resources to drive resolution.
- Perform engineering verification test for new and existing modules triggered by business needs.
- Optimization of the Die Bonder system with the focus on accuracy, stability and productivity.
- Participation in the development of hardware and software modules of Die Bonder equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification).
- Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences as continuous improvement project.
Customer Support
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