Job Description

Skill - Advanced package Design (APD)

Location- Bangalore

Experience - 5+years


JD

  • Good hands-on experience in IC Package Substrate design and Interposer Design
  • Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)
  • Good knowledge of substrate structure, design rules and material property
  • Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalent
  • Experience of Synopsys 3D IC compiler and ICC2 is added advantage
  • Design experience with MCM/SiP packages, module schematic and layout design experience
  • Knowledge of Complex, High-Speed PCB, and IC Packaging
  • Understanding/ experience in scripting – Perl/ SKILL programming
  • Understanding of DRC and DFM (Design For Manufacturing)
  • Understanding in SI/PI tools, package model extraction, S-parameter

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