Job Description

Piper Companies is looking for an Advanced Packaging Integration Engineer to join a cutting-edge startup onsite in Saratoga, CA. The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.

Responsibilities for the Advanced Packaging Integration Engineer:

  • Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production.
  • Collaborate with global teams, including TSMC in Taiwan, to align packaging strategies with system-level requirements.
  • Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies.
  • Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.

    • Qualifications for the Advanced Packaging Integration Engineer:

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