Job Description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence Design Systems is looking for a candidate to join the Silicon Package Board (SPB) team as a full time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.



The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies. Understanding of competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.







Job Description:





+ Helping customers to adopt and proliferate our packaging solu...

Apply for this Position

Ready to join Cadence Design Systems, Inc.? Click the button below to submit your application.

Submit Application