Application / Process Engineer - Die Bond Tools

The Talent People x JSIT-PE

The Talent People is proud to partner with JSIT-PE, a government initiative aimed at strengthening Singapore's Precision Engineering sector by addressing manpower challenges and fostering industry growth.

By applying for our job opportunities, you're joining a strategic effort to enhance Singapore's Precision Engineering landscape.

Company Overview:

Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product portfolio includes Flip-Chip Bonders, Chip-on-Wafer Bonders, Package-on-Package (PoP) Bonders, Stack Die Bonders, Panel-Level Die Bonders, and Multi-Chip Die Bonders, among others. We are committed to driving innovation in semiconductor backend p...