Job Description



Assembler

Job Description:

This role will be an assembly operator working withvarious SMT, Die Attach or Wire Bonding equipment.

Responsibilities:

  • Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
  • Operate and set-up manual Gold wire bonders, manual eutectic/epoxy die attach systems or SMT equipment per documented work instructions.
  • Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883.
  • Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883.
  • Operator is responsible for proper soldering of components – both manual and automatic per IPC-610 standards.
  • Flexibility to be trained in multiple Microelectronics processes that invo...

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