Job Description

Assembly Process Engineer

Job Description:

As a Microelectronic Assembly Process Engineer, you will have manufacturing responsibility for high volume manufacturing of Aerospace and Defense, Telecommunications and SATCOM devices.In that capacity, the ideal candidate would lead process development and sustaining activities involving semiconductor laser and silicon photonic chips.These include developing processes for mass manufacturing Optical devices and subsystems, utilizing Eutectic & Epoxy die attach, wire-bonding and precision die placement. With at least three years of hands-on experience in assembly, integration and test of microelectronic devices, you’ll work with other engineers to introduce/transfer (NPI) novel opto-electronics devices to precision large scale manufacturing. You will work closely with R&D engineers to validate, test and qualify research and development prototypes in preparation for large scale manufacturing.

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