Job Description

Are you passionate about pushing the boundaries of semiconductor innovation? Join us to explore heterogeneous integration for next-generation chips with unprecedented energy efficiency.

Introduction

The convergence of different semiconductor technologies, advanced materials, and innovative packaging is opening new frontiers in chip design, manufacturing and applications. Heterogeneous integrationcombining, , photonics, electronics, antennas, and/or MEMS at wafer scaleenables breakthroughs in energy efficiency, and bandwidth for next-generation systems based on chips. This position offers an exciting opportunity to develop and lead research in advanced integration technologies and their applications, shaping the future of semiconductor miniaturization and high-performance systems.

Group

You will join the group, a European leader in photonic integrated circuits (PICs) and semiconductor process technologies. The group has a strong tra...

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