Job Description

The Associate Engineer – Backgrind & Dicing position supports critical wafer manufacturing processes by processing backgrind and dicing before final shipment. This role focuses on operating, monitoring, and improving backgrinding and dicing processes, including equipment setup, process control, and defect reduction. The Associate Engineer works closely with process/eqpt engineers, product/lot owner and cross-functional teams to troubleshoot issues, implement process improvements, and maintain compliance with safety and quality standards. This position is ideal for individuals with past hands on experiences in assembly/backgrind/dicing.

About GlobalFoundries



GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the tec...

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