Job Description
Chip Packaging Technologist, Google Cloud
_corporate_fare_ Google _place_ Taipei, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
_info_outline_
XGoogle welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: **Taipei, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan** .
**Minimum qualifications:**
+ Bachelor's degree in Materials, Mechanical, Electrical Engineering, a related field, or equivalent practical experience.
+ 5 years of experience in working with 3D packaging.
+ 5 years of experience in working with foundries and OSATs for package development.
**Preferred qualifications:**
+ Experience in semiconductor package manufacturing, wi...
_corporate_fare_ Google _place_ Taipei, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
_info_outline_
XGoogle welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: **Taipei, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan** .
**Minimum qualifications:**
+ Bachelor's degree in Materials, Mechanical, Electrical Engineering, a related field, or equivalent practical experience.
+ 5 years of experience in working with 3D packaging.
+ 5 years of experience in working with foundries and OSATs for package development.
**Preferred qualifications:**
+ Experience in semiconductor package manufacturing, wi...
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