CVD Process Engineer - Wafer Bonding

About Samsung Austin Semiconductor
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Position Summary

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintains detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24 / 7 wafer bonding operation.

Role and Responsibilities

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