Design Engineer - Hardware Packaging

Design and development of electronic and electro-mechanical systems like
dashboard, controller module, converter modules, charger, sensors, actuators for
various applications.
? Testing and Validation of systems designed and interactions between them by
understanding the vehicle architecture.
? Design and Development of enclosures in plastic, sheet metal, casting, etc for
various electrical and electronic assemblies that are part of the vehicle and charging
infrastructure.
? Responsible for ensuring manufacturability of electronic box build assembly
components and drive quality controls.
? Make significant contributions to review of Tools, Jigs, Fixtures and End of Line test
equipment at supplier locations.
? Responsible for Electromechanical Interaction and Impact Analysis and experience
in Tolerance stack-up.
? Regression testing including Thermals, Sealing, Vibration, Shock, and structural
tests across 3D Printed prototypes and off the tool and process samples and DVT of
electronic packaging enclosures and electrical harness.
? Maximize reuse of platforms and design resources to help reduce TTM, cost, and to
enhance quality; implement lessons learnt into designs.
? Participate in and contribute to DFMEA, DFM, DFA, DFC, DFS, DFR, and component
selection/derating reviews carry out RCA on field failures and
implement/recommend CAPA.
? Participate in regulatory tests such as UL, ARAI, BIS, IEC standards for
electrical/electronic assemblies.
? Performing Problem solving using industry best practices such as 5-Why analysis,
Fishbone diagram, RCA methodologies etc..
? Project execution following PMP, Agile methodologies
HERE S WHAT WE ARE LOOKING FOR:
? Experience in designing plastics and sheet-metal for electro-mechanical enclosures
with attention to electromechanical interactions.
? Experience in material selection, manufacturing process for Plastics, sheet metal
and casting.
? Advanced knowledge in fasteners, inserts, surface treatment methodologies, and
engineering plastics used for electronic packaging.
? Knowledge of Geometric Dimensioning & Tolerancing, generation of First Article
Report (FAR)
? Knowledge of DFMEA, PFMEA, AFMEA DFM, DFA, DFC, DFR, DFS, Poka-Yoke
methods and techniques, sealing and venting mechanisms
? Experience of working in at least one complete product development life
cycle.
? Knowledge on APQP, PFMEA, and basics of tool design will be an added
advantage .
? Exposure to PPAP and Supplier quality audits .
? Understanding of electronics components will be an added advantage.
? Exposure to PCBA interaction and packaging of the same in an enclosure
considering the power dissipation, EMI/EMC requirements
? Knowledge on Thermal design including interface materials and simulation
will be an added advantage
? Experience with working on SW tools such as Siemens NX, PLM Tools (
Teamcenter, JIRA etc..), FMEA tools, Pugh Matrix and Basic understanding of
CAE tools such as Ansys/Fluent.
? A good team player with interpersonal planning and go