Job Description

Responsibilities

:
  • Producing and implementing designs to meet customer specifications for:

  • Low cost and thermally efficient package platforms

  • LTE, carrier aggregation, multiple antennas, filters, and power management

  • Ruggedness, ESD, and quality

  • Meeting performance requirements while also considering size, cost, footprint, and schedule

  • Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data

  • Partnering with technicians to perform circuit simulations and testing as needed

  • Designing, testing, and tuning of RF PAs

  • Developing and executing test plans for electronics package mechanical robustness

  • Developing application guidelines for package assembly into next level assembly

  • Creating basic algorithms for automating FEA model generation

  • Potential to work with:

  • Signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data

  • Transistor level circuit design, simulation, and layout

  • Analog and RF measurement
    • Qualifications:
  • Currently pursuing a BS, MS, PhD in Electrical or Mechanical Engineering

  • Minimum 3.0 GPA

  • RF circuit design course work and/or experience strongly preferred

  • Exposure to RF measurement equipment such as, spectrum analyzers and network analyzers preferred

  • Proficiency with Microsoft Office (Excel, Word, PowerPoint)

  • Software Exposure: ADS, FEM, HFSS, Momentum, Cadence, Dynamic Link, 3D CAD, Mechanical FEA

  • Self-Starter with strong written and verbal communication skills

  • Effective organization skills for systematic planning and scheduling

  • Detail oriented to ensure design and delivery of high yielding products
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