Die Attach TD Module Engineer

# **Welcome!**## .Die Attach TD Module Engineer page is loaded## Die Attach TD Module Engineerlocations: Malaysia, Kulimtime type: Full timeposted on: Posted Todayjob requisition id: JR # **Job Details:**## Job Description:The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative.* The candidate will define and establish process flow, procedures, and equipment configuration for NPI products.* Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.* Plans and conducts experiments to fully characterize the process throughout the development cycle.* Drives improvements on quality, reliability, cost, yield, process stability/proficiency, productivity and safety/ergonomic over variables such as material, method, equipment, e...