Die Attach TD Module Engineer

Intel Corporation

📍 Kulim, Kedah, Malaysia

Full-time Engineering Posted January 29, 2026

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Job Description

                        # **Welcome!**## .Die Attach TD Module Engineer page is loaded## Die Attach TD Module Engineerlocations:   Malaysia, Kulimtime type:   Full timeposted on:   Posted Todayjob requisition id:   JR # **Job Details:**## Job Description:The position is for Package Module Development Engineer for Thermal C...
                    

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Job Details

Location

Kulim, Kedah, Malaysia

Job Type

Full-time