Job Description

Your Role

Key responsibilities in your new role:

  • Strong background in semiconductor BE packaging manufacturing and/or fabrication, specifically in Power Devices, with a minimum of 15 years of experience and at least 5 years of management experience.
  • Requires exceptional technical expertise, strong leadership skills, and the ability to drive strategic initiatives.
  • Responsible for leading cross-functional teams to develop and implement strategies for yield, cost, quality, and test improvements for Power Modules and Power Chip Embedded (CE) IC products at OSAT subcons in Malaysia, Thailand, Vietnam, China and other countries.
  • Supporting introduction of new products, processes, and test methodologies, as well as collaborating with internal stakeholders in USA and Europe to ensure alignment with business objectives.

Your Profile

Qualifications and skills to help you succeed:

  • Bachelor of Scien...

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