Job Description

JOB SUMMARY: Electromigration reliability is becoming increasingly critical as interconnect dimensions continue to shrink and current density increases, especially for high-performance computing and advanced packaging applications. This project focuses on building and validating electromigration testing capability and evaluating the EM performance of multiple solder and interconnect materials. The intern will assist with sample preparation, EM test execution, and data collection under controlled temperature and current density conditions.

ESSENTIAL JOB FUNCTIONS (COMPETENCIES):

+ Assist with preparation and reflow of planar EM test samples using various solder and interconnect materials.

+ Support setup, validation, and troubleshooting of electromigration test hardware.

+ Collect, organize, and pre-process EM test data for analysis and reporting.

+ Perform electrical measurements and resistance monitoring.

+ Document test procedu...

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