Job Description
Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out
Bond Period : 15 or 18 Month bond
Embedded Hardware Engineer Trainee (EC):
- Knowledge of Embedded HW design in Digital, Analog, and Mixed-signal circuit design.
- Know how for Power supply design, battery management, ADCs, memories, buffers, drivers, amplifiers, Microcontroller design, and different hardware protocols (UART, I2 C, SPI, etc)
-Familiarity with communication protocols at the hardware level- BLE, Zigbee, Wi-Fi, GPS... etc.
-Interest in Schematic design, PCB review, Circuit simulation. (Orcad allegro)
Bond Period : 15 or 18 Month bond
Embedded Hardware Engineer Trainee (EC):
- Knowledge of Embedded HW design in Digital, Analog, and Mixed-signal circuit design.
- Know how for Power supply design, battery management, ADCs, memories, buffers, drivers, amplifiers, Microcontroller design, and different hardware protocols (UART, I2 C, SPI, etc)
-Familiarity with communication protocols at the hardware level- BLE, Zigbee, Wi-Fi, GPS... etc.
-Interest in Schematic design, PCB review, Circuit simulation. (Orcad allegro)
Apply for this Position
Ready to join ? Click the button below to submit your application.
Submit Application