Job Description
Qualification: Btech/BE Electronics and Communications : 2025/2026 Pass out
Bond Period : 15 or 18 Month bond
Embedded Firmware Engineer Trainee (EC):
- Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller)
-good knowledge of C, C++ programming
- Know how for RTOS is preferable
-Knowledge of protocols and interfaces such as UART, USART, SPI, I2 C, CAN, LIN, Ethernet, Wi Fi, Bluetooth, GSM, GPRS
-Understanding of embedded hardware
Bond Period : 15 or 18 Month bond
Embedded Firmware Engineer Trainee (EC):
- Knowledge with 8/16/32 bit microcontroller (including ARM microcontroller)
-good knowledge of C, C++ programming
- Know how for RTOS is preferable
-Knowledge of protocols and interfaces such as UART, USART, SPI, I2 C, CAN, LIN, Ethernet, Wi Fi, Bluetooth, GSM, GPRS
-Understanding of embedded hardware
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