Job Description

Role & Responsibilities

  • Manage the tapeout process from customer engagement to final jobview release.
  • Support customers during design, including DRC review, waivers, GDS preparation, and floorplanning.
  • Coordinate tapeout activities with foundry and customer engineering teams.
  • Oversee jobview and MEBES approval for tapeout.
  • Validate component performance against design targets.
  • Contribute to Si photonics design and PDK enhancement for DFM.
  • Support PDK development and technology roadmap with design services.

Qualifications

  • Degree (PhD/Master's/Degree) in Microelectronics, Electrical/Electronic Engineering, Physics, or Materials Science.
  • Years' experience in design enablement and/or tapeout operations with foundry customers.
  • Si photonics experience is an advantage.

For interested applicant, kindly send your resume in Word/PDF format, include the following informat...

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