Engineering Design Manager – Thermo-Compression Bonding (TCB) Equipment

Company Overview

PYXIS CF Pte Ltd is an advanced semiconductor equipment company specializing in the design and development of high-precision Thermo-Compression Bonding (TCB) systems for advanced packaging applications, including large‑die, multi‑chip, and heterogeneous integration platforms (HBM, CoWoS‑type architectures, panel‑level packaging). The company designs and builds proprietary bonding platforms integrating ultra‑precision mechanics, thermal systems, vision alignment, and force‑controlled bonding technologies.

Position Summary

The Engineering Design Manager – TCB Equipment will lead the end‑to‑end mechanical and mechatronic design of next‑generation Thermo‑Compression Bonders. This role is responsible for translating process requirements into production‑ready machine architectures, owning critical subsystems, and ensuring that designs meet stringent accuracy, thermal, force, reliability, and manufacturability targets.

The position requires deep prior experience in designing complete semiconductor bonding tools, not just modules, and the ability to make architecture‑level trade‑offs under aggressive development schedules.

Key Responsibilities

1. System & Architecture Ownership

• Lead the mechanical architecture design of Thermo‑Compression Bonders from concept to production release
• Define system‑level layouts covering: Bondhead and Z‑axis architecture; die handling and substrate support structures; frame stiffness, vibration control, and thermal isolation
• Drive tolerance stack‑ups, error budgets, and mechanical accuracy targets at system level

2. Critical Subsystem Design Leadership

Own and review detailed designs for critical TCB subsystems, including but not limited to:

• Bondhead assemblies (force path, stiffness, thermal flow, compliance)
• Precision Z‑axis and XY‑Theta stages
• Heated tooling interfaces and thermal isolation structures
• Die ejector and pick‑up mechanisms
• Tooling change, calibration, and alignment features

Ensure designs are robust under:

• High temperature gradients
• Repeated thermal cycling

3. Thermal‑Mechanical Integration

• Work closely with process and thermal teams to manage: heat flow paths; warpage risks in large and heterogeneous dies; interaction between heaters, tooling, and mechanical structures
• Design structures that minimize thermal drift while maintaining mechanical rigidity

4. Design for Manufacturing & Assembly (DFM/DFA)

• Ensure designs are suitable for precision machining and assembly
• Define assembly sequences; alignment methods; shimming and calibration strategies
• Work with vendors and internal manufacturing teams to resolve fabrication and assembly challenges

5. Cross‑Functional Technical Leadership

• Act as the technical authority on mechanical design decisions
• Interface closely with process engineering, controls and software teams, and vision and metrology teams
• Translate customer requirements into actionable design specifications

6. Design Reviews, Validation & Risk Management

• Lead formal design reviews (concept, preliminary, detailed)
• Identify and mitigate technical risks early in the development cycle
• Support system integration, FAT, and customer acceptance activities from a design standpoint

7. Mentorship & Knowledge Leadership

• Provide technical guidance to senior and junior mechanical engineers
• Set design standards, documentation practices, and engineering discipline within the team
• Serve as a long‑term knowledge anchor for TCB platform design

Required Qualifications

Education

• Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or a closely related field

Experience (Strictly Required)

• 10–15+ years of hands‑on experience in semiconductor equipment mechanical design
• Direct experience designing Thermo‑Compression Bonders or equivalent advanced bonding / placement tools
• Proven track record of designing complete machines or major subsystems that reached production or customer deployment; working with tight accuracy requirements (micron‑level alignment, controlled force application)

Technical Expertise

• Deep understanding of precision machine design principles; structural stiffness, vibration and thermal effects; tolerance analysis and error budgeting
• Strong proficiency in 3D CAD (SolidWorks, Creo, NX or equivalent)
• Experience with precision stages and motion systems; heated tooling and high‑temperature mechanical interfaces; semiconductor cleanroom equipment constraints

Highly Preferred (Differentiators)

• Prior experience as Lead Designer or Engineering Manager for bonding or advanced packaging tools
• Experience with large‑die or heterogeneous integration platforms
• Exposure to customer‑facing engineering roles, FAT, and on‑site tool support
• Ability to balance first‑principles engineering with pragmatic schedule‑driven decisions

Why This Role Is Critical

This role is central to the company’s ability to deliver next‑generation TCB platforms where mechanical design directly determines yield, accuracy, and long‑term reliability. The position requires rare, accumulated expertise that cannot be substituted by general mechanical engineers or short‑term training.

Employment Details

• Location: Singapore
• Seniority: Senior Manager /Principal Engineer level
• Role Type: Full‑time, long‑term technical leadership position