Equipment Engineer (Die Prep/Surface Mount Technology)

Overview

Managing the Assembly Engineering machine related to:
1. Die Prep (Backgrind, Laser, Sawing/Dicing, Pick & Place, 2nd Opt)
2. FOL (SMT, Solder Paste Printing, Chip Cap Attach, Fluxer, Reflow Oven, Flux Clean)

Lead in project management and ensure all requirements in the development or improvement of equipment for processor functional tests are met.

Ensure equipment operation procedures and maintenance programs are in place.

Drive improvements, initiate problem-solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities, and higher efficiency,

Ensure timely execution of new product or process development and qualification. Demonstrates discipline in the timely execution of tasks.

Manage/audit/liaise with suppliers and vendors to achieve quality, cost and risk management requirements. Plan and manage budgets as well as support capital planning and cost reduction initiative...