Job Description

A leading technology firm in Malaysia is seeking a Die Bond & Wire Bond Engineer to support semiconductor assembly from development to mass production. The ideal candidate will have a Bachelor's degree in Engineering and a strong willingness to learn. Responsibilities include optimizing bonding processes, troubleshooting issues, and collaborating with cross-functional teams. The role offers a flexible and inclusive work environment with a hybrid model and opportunities for professional growth.
#J-18808-Ljbffr

Apply for this Position

Ready to join Afterschool? Click the button below to submit your application.

Submit Application