Graduate Process Engineer

Job Description

As a Die Bond & Wire Bond Engineer, you will be part of a dynamic manufacturing team, supporting semiconductor assembly processes from development to mass production. This role is ideal for fresh graduates who are eager to learn, hands‑on, and passionate about process improvement.

Responsibilities

• Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability.
• Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment‑related problems.
• Participate in new product introduction (NPI), process qualification, and transition to mass production.
• Help establish and update process parameters, work instructions, and control plans.
• Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis.
• Work closely with cross‑functional teams including Product...