Job Description
Join Renesas as a Die Bond & Wire Bond Engineer supporting semiconductor assembly from development to mass production in a dynamic team.
Your role
Here’s what you will be doing:
- Support the development, optimization, and maintenance of die bond and wire bond processes to ensure quality, yield, and reliability
- Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment problems
- Participate in new product introduction (NPI), process qualification, and transition to mass production
- Help establish and update process parameters, work instructions, and control plans
- Analyze process data using statistical tools such as SPC, CPK, and trend analysis
- Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
- Contribute to continuous improvement initiatives to enhance yield, cost efficiency, cycle time, and product reliability
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