Job Description

Hardware Engineering Intern, PhD, Summer 2026

_corporate_fare_ Google _place_ Taipei, Taiwan _bar_chart_ Intern & Apprentice

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Applications will be reviewed on a rolling basis and it’s in the applicant's best interest to apply early. The anticipated application window is open until **March 27, 2026** , but may close earlier if all available projects are full. Applications submitted after the application window or once role is closed/projects are full will not be considered.

Participation in the internship program requires that you are located in the Taiwan for the duration of the internship program.

This internship is intended for students who are currently pursuing a PhD degree program in Electronics and Communication Engineering, Electrical Engineering, Thermal Engineering, Mechanical Engineering, Power, or a related technical field.

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