IC Packaging Simulation Engineer

Roles & Responsibilities:

· Perform thermal, stress, warpage, electrical simulations post package designing to meet product data requirements based on customer specifications.

· Knowledge of electrical and package simulation in relation to substrate design and data analysis.

· Numerical modeling of the stress and deformation of component packages to provide comprehensive understanding of chip-package interaction.

· Deep understanding of packaging materials and their mechanical behaviors.

· Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a plus.

Requirements:

· Bachelor or Master Degree in Electrical, Mechanical, or Materials Science Engineering.

· Good understanding of Advanced Packaging architecture and semiconductor packaging process flow.

· Handson experience in using package simulations software too...