Job Description

A leading semiconductor company in Malaysia is seeking a candidate for a PAK Die bank wip management project. Applicants should hold a Diploma or Degree in Electrical & Electronics Engineering with a minimum CGPA of 3.0. This role emphasizes the company's commitment to decarbonization, digitalization, and inclusion in the workplace. The successful candidate will play a vital part in driving innovation and customer success, working in an environment that values trust, respect, and diversity.
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