Intern- Process Engineering Assistant

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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

•Location: Singapore•Department: –Process andEquipment Engineering•Project Title: Backgrind Process Wafer Thickness run to run auto thickness adjustment enablement•Project Description: Data analytics and machine auto-adjustment has been introduced in the Micron manufacturing operations to improve efficiency. Auto drift detection analysis and correction will significantly improve the process efficiency.–Objective of the project: Enable wafer thickness drift detection and auto correction.–The student will have the opportunity to learn and apply industrial data analytics, simulation and optimization skills to solve the practical issues and bring real impact on the state-of-arts semiconductor manufacturing process. –The intern will also have opportunity to participate to an end-to-end solution development team to contribute ideas and learn from industrial subject experts. •Project Scope: –Explore various machine learning techniques for the feature selection, simulation, evaluation and measurement data. Explore inline and probe data correlation. Explore multiple variables optimization. Explore SPC.–Deliverable: Stableprocesswithearlydriftdetectionandauto-correction–Impact of Project: Improve product quality control and process efficiency•Skillset Require: General problem solving, data analytics, and SPC.•Course of interests: Mechanical engineering and statistic related courses.•Duration Period: min 5months