Job Description
Details Through Glass Via (TGV) Metallization Breakthrough Integration to Redistribution Layer (RDL) circuit formation Tomorrow’s advanced packages and applications Wafer level processing technologies Position Desc...
Posted: 20-May-24
New Albany, Indiana
Type: Full Time
Salary: $85K-$125K
Years of Experience:
5 - 10Required Education:
4 Year DegreeInternal Number: 20240255580
Samtec began investing in Microelectronics in 2010 and has emerged as a technology leader in advanced glass-based packages. As we build on our core technologies, advanced materials development is mission critical for our applications, requiring world class materials research by innovative experts responsible for increasing our lead. We see great things ahead for our Glass Core Technology group and will drive our exciting roadmap with talented people:Apply for this Position
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