Job Description

  • Lead and execute Analog Mixed-Signal layout design for high-speed DDR/HBM IPs
  • Deliver robust and high-quality physical layout designs ensuring adherence to DDR/HBM specs
  • Apply deep understanding of FinFET and CMOS technology at 28nm and below
  • Handle high-speed digital layout verification with attention to signal integrity
  • Implement advanced floorplanning techniques and apply submicron mitigation strategies
  • Coordinate with remote layout teams globally for layout quality and deliverables
  • Drive internal flow adherence for tape-out readiness and schedule compliance
  • Collaborate with PHY designers, package engineers, and system teams to meet design objectives
  • Oversee IO layout requirements including bondpads, ESD, IR/EM, and DFM considerations
  • Utilize physical verification tools and support Place & Route and top-level verification flows

The Impact You Will Have:

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