Job Description
Roles: Manufacturing Lead- OSAT Packaging & Test
Experience: 5-15 Yrs
Location: Jagiroad, Assam.
Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.
Job Description
Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
To Planning & execution of the Targeted manufacturing Volumes.
Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
Support NPI and technology transfers with equipment, materials, and process alignment
Conduct root cause analysis and implement corrective actions for process deviations
Collaborate with design, test, substrate, and reliability teams for seamless product flow
Maintain process documentation, control plans, and...
Experience: 5-15 Yrs
Location: Jagiroad, Assam.
Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.
Job Description
Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
To Planning & execution of the Targeted manufacturing Volumes.
Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
Support NPI and technology transfers with equipment, materials, and process alignment
Conduct root cause analysis and implement corrective actions for process deviations
Collaborate with design, test, substrate, and reliability teams for seamless product flow
Maintain process documentation, control plans, and...
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