Job Description
Roles: Manufacturing Lead- OSAT Packaging & Test
Experience: 5-15 Yrs
Location: Jagiroad, Assam.
Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.
Job Description
- Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
- To Planning & execution of the Targeted manufacturing Volumes.
- Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
- Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
- Support NPI and technology transfers with equipment, materials, and process alignment
- Conduct root cause analysis and implement corrective actions for process deviations
- Collaborate with design, test, substrate, and reliability teams for seamless product flow
- Maintain process documentation, contro...
Experience: 5-15 Yrs
Location: Jagiroad, Assam.
Education Qualification: Bachelor’s or Master’s degree in Electronics, Mechanical, Manufacturing Engineering.
Job Description
- Experienced in manufacturing operations for wire bond, flip chip, and integrated system packaging and Testing of High Volume OSAT Semiconductor Manufacturing.
- To Planning & execution of the Targeted manufacturing Volumes.
- Ensure process stability, yield optimization, and cycle time reduction across packaging and test lines
- Manage daily OSAT interactions for issue resolution, performance tracking, and continuous improvement
- Support NPI and technology transfers with equipment, materials, and process alignment
- Conduct root cause analysis and implement corrective actions for process deviations
- Collaborate with design, test, substrate, and reliability teams for seamless product flow
- Maintain process documentation, contro...
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