Job Description

Job Description

  • Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
  • Experience in electronic board design
  • Experience in leading full life cycle projects
  • Experience with PLM systems, engineering changes, BOM structuring, etc.
  • Experience in design of indoor and outdoor equipment
  • Experience in thermal, dynamical and statical design and analysis
  • Experience in design of telecommunication/RF equipment – an advantage
  • Experience in mentoring engineers – an advantage
  • Perform analysis, testing, design iterations, and validation of the designs

    • Job Requirements

  • Qualification: BE in Mechanical Engineering from an accredited university. ME an advantage
  • At least 5 years of experience in electronics packaging design
  • Strong understanding of GD&T, drawings, assembly tolerances
  • Proficiency in SolidWorks
  • Proficiency in writing as well as speaking in English
  • Must be self-motivated, able to work under pressure, and multitask
  • Team player with strong technical and communication skills

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