Job Description
**Job Details:**
**Job Description:**
Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing start of the art mechanical and opto-mechanical design for next generation of co-packaged optics and optical interconnect products (CPO/OCI).
You will contribute to Intel Integrated Photonics Group's (IPS) mission to transform and lead Data Center optical connectivity and enable Intel's differentiation in the networking space.
Your responsibilities will include:
+ Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (SiPh) devices and assemblies in data center.
+ Package designs and technology selection
+ Assess and mitigate risks associated with the product designs
+ Working with cross-functional groups to determine package requirements in order to meet electrical, opti...
**Job Description:**
Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing start of the art mechanical and opto-mechanical design for next generation of co-packaged optics and optical interconnect products (CPO/OCI).
You will contribute to Intel Integrated Photonics Group's (IPS) mission to transform and lead Data Center optical connectivity and enable Intel's differentiation in the networking space.
Your responsibilities will include:
+ Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (SiPh) devices and assemblies in data center.
+ Package designs and technology selection
+ Assess and mitigate risks associated with the product designs
+ Working with cross-functional groups to determine package requirements in order to meet electrical, opti...
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