Job Description
1 opening: 12 Months: Us Citizen: $68.51
Required Experience:
CREO: 3-6 years
Materials: 2+ years
CCA experience: 3-6 years
PCB board level design experience: 3+ years
Thermal Analysis : 3+ years
BOM and Windchill Release experience: 3-6 years
Technical Drawing: 3-6 years experience
Packaging experience : 3-6 years
• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing c...
Required Experience:
CREO: 3-6 years
Materials: 2+ years
CCA experience: 3-6 years
PCB board level design experience: 3+ years
Thermal Analysis : 3+ years
BOM and Windchill Release experience: 3-6 years
Technical Drawing: 3-6 years experience
Packaging experience : 3-6 years
• Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing c...
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