Job Description

A leading semiconductor company is seeking a Packaging Engineer to join their Packaging Modeling Team in Barcelona. The ideal candidate will have a Master's degree and strong understanding of thermal physics, FEA simulation tools, and packaging technologies. Responsibilities include conducting simulations, developing methodologies, and collaborating with global teams. This onsite role requires effective communication and the ability to work in a collaborative environment. Come innovate with us and shape the future of technology!
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