Job Description

We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG).

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a passionate Package Design Engineer who is committed to making a difference in the world through their contributions. You will be responsible for leading package test vehicle designs for all NVIDIA products. These test vehicles lead the way in enabling cutting edge package technologies in NVIDIA products.

What you'll be doing:
+ Your responsibilities will include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles
+ The focus will be primarily on flip chip and 2.5D interposer based packages
+ Implement electrical/mechanical/thermal structures in test vehicles...

Apply for this Position

Ready to join NVIDIA? Click the button below to submit your application.

Submit Application