Job Description

Package Design Lead Engineer, Google Cloud

_corporate_fare_ Google _place_ Sunnyvale, CA, USA

**Advanced**

Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain.

**Minimum qualifications:**

+ Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
+ 8 years of industry experience in chip package design/layout using Cadence APD or Mentor Expedition.
+ Experience in chip package substrate layout, design verification, Design for Manufacturing (DFM) and taping out for production.
+ Experience in design automation and scripting.

**Preferred qualifications:**

+ Experience in large-scale 2.5D/3.5D advanced package design.
+ Experience in working with cross-functional teams including chip design, SI/PI, and Printed Circuit Board (PCB) design teams.
+ Experien...

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